XHX conceived and co-wrote the paper. ALS, FR, WW, GXC, and ZGD participated in the sample characterization. CZJ participated in its design and coordination. All authors read and approved the final manuscript.”
“Background Recently, outstanding achievements have been made in the development of a novel class of uncooled microbolometer infrared (IR) focal plane arrays (FPAs), the ones based on Si-on-insulator diodes as temperature sensors, whose format has reached 2 megapixels with a noise
equivalent temperature difference (NETD) of 60 mK at the frame rate of 15 Hz and the f-number of 1; the same group has also demonstrated a VGA FPA with outstanding NETD of 21 mK (at f/1, 30 Hz) (see, e. g., [1] and earlier articles cited therein). This success, as well Selleck CHIR99021 as previous achievements in this field [2–4], stimulates the search for simple complementary metal-oxide semiconductor CYT387 clinical trial (CMOS)-compatible technological solutions based on diode bolometers which would be suitable for mass production of IR FPAs
with low cost and NETD figures sufficient for many civil applications [5–9]. One of such solutions consists in utilization of metal/poly-Si Schottky barriers for the formation of sets of temperature sensors on bolometer membranes [8, 10]. Schottky barrier bolometer arrays seem to be first proposed theoretically for very sensitive cooled bolometers [11]. In this article, nickel silicide Schottky diodes formed on polycrystalline Si 〈P〉 films are proposed as thermosensitive elements of monolithic uncooled microbolometer IR FPAs. The Copanlisib chemical structure possibility of integration of technological process of the silicide-based Schottky diode structure formation into the standard CMOS technology of VLSI manufacturing [12] as well as the possibility
of cascade connection of Schottky L-NAME HCl diodes to increase the temperature sensitivity of bolometer elements of FPA and the use of layers of the diode structures as absorbing coatings in bolometers are advantages of these structures. Methods Sample preparation and characterization techniques Schottky barriers were formed on commercial single-crystalline Czochralski-grown silicon wafers (ρ=12Ωcm, (100), p-type) coated by about 600-nm-thick layer of SiO2 formed by thermal oxidation and about 180-nm-thick layer of pyrolytic Si3N4 (the dielectric layers simulated a design of the supporting membranes of the previously tested bolometer cells [10, 13, 14]). Films of polycrystalline Si 〈P〉 with the thicknesses of about 150 nm were deposited by thermal decomposition of monosilane at the substrate temperature T s≈620℃; then they were doped with phosphorus by ion implantation (E = 35 keV) to the dose of 5×1015 cm −2 and annealed at 700℃ for 30 min.