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CrossRef 17. Chang H, Choi Y, Kong K, Ryu BH: Atomic and electronic structures of amorphous Al 2 O 3 . Chem Phys Lett 2004,391(4–6):293–296.CrossRef 18. Perevalov TV, Tereshenko OE, Gritsenko VA, Pustovarov VA, Yelisseyev AP, Park C, Han JH, Lee C: Oxygen deficiency defects in amorphous Al 2 O 3 . J Appl Phys 2010,108(1):013501.CrossRef 19. Takahashi N, Mizoguchi T, Tohei T, Nakamura K, Nakagawa T, Shibata N, Yamamoto T, Ikuhara Y: First principles calculations of vacancy formation energies in Σ13 pyramidal twin grain boundary of α-Al 2 O 3 . Mater Trans 2009,50(5):1019–1022.CrossRef

20. Li TTA, Ruffell S, Tucci M, Mansoulié Y, Samundsett C, De selleck products Iullis S, Serenelli L, Cuevas A: https://www.selleckchem.com/products/LBH-589.html Influence of oxygen on the sputtering of aluminum oxide for the surface passivation of crystalline silicon. Sol Energ Mater Sol Cell 2011,95(1):69–72.CrossRef GW4869 concentration 21. Dou YN, He Y, Huang CY, Zhou CL, Ma XG, Chen R, Chu JH: Role of surface fixed charge in the surface passivation of thermal atomic layer deposited Al 2 O 3

on crystalline-Si. Appl Phys A Mater Sci Process 2012,109(3):673–677.CrossRef 22. Yu RS, Ito K, Hirata K, Sato K, Zheng W, Kobayashi Y: Positron annihilation study of defects and Si nanoprecipitation in sputter-deposited silicon oxide films. Chem Phys Lett 2003,379(3):359–363.CrossRef 23. Matsunaga K, Tanaka T, Yamamoto T, Ikuhara Y: First-principles calculations of intrinsic defects in Al 2 O 3 . Phys Rev B 2003,68(8):085110.CrossRef 24. Peacock P, Robertson J: Behavior of hydrogen in high dielectric constant oxide gate insulators. Appl Phys Lett 2003,83(10):2025–2027.CrossRef Competing interests The authors declare that they have no competing interests. Authors’ Ketotifen contributions YZ participated in the design of the study, carried out the fabrication of Al2O3 films, performed the statistical analysis, as well as drafted the manuscript. CLZ designed the study to find

the relation between negative-charged Al vacancy and Q f . XZ carried out the TEM analysis and participated in the Q f test. YND performed the film deposition. PZ, XZC, and BYW provided the Beijing Slow Positron Beam and performed the positron BDAR analysis. WJW, YHT, and SZ co-wrote the paper. All authors read and approved the final manuscript.”
“Background Silicon carbide is a promising material for numerous electronic applications due to its wide bandgap, high breakdown electric field, high thermal conductivity, and high saturation velocity [1]. These excellent properties make SiC suitable for high-temperature, high-power, and high-frequency applications. For high-performance and high-frequency devices in these applications, metal/SiC contact plays very important roles. However, the traditional method for fabricating Schottky contact and ohmic contact are so different, and it will unavoidably add to the processing difficulty and cost [2].

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